Automatic extraction of component inspection regions from
Printed Circuit Board
Abstract:
The inspection machine in PCB(Printed Circuit Board)
assembly line checks for assembly errors by examining the images inside the
component inspection region. The component inspection region consists of a
component package region and a soldering region. The regions need to be
extracted automatically so the auto-teaching system of the inspection machine
can work. An image segmentation method was proposed to extract the component
inspection regions automatically from the images of the PCB. The acquired image
was transformed to HSI color model, and then segmented by several regions by a
clustering method. A modified K-means algorithm was developed to increase the
accuracy of extraction. The heuristics generating the initial clusters and
merging the final clusters were newly proposed. The vertical and horizontal
projection was also developed to distinguish the region of the component package
and the region of soldering. The experimental results are presented to
highlight the utility of the proposed method
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